|
Maximum Temperature |
1400°C |
|
Standard Heating Zone Length (mm) |
350 |
|
Chamber Size (mm) |
80×350 |
|
Standard Tube Diameter (mm) |
∮80 |
|
Total Length of Furnace Tube (mm) |
1000 |
|
External Size |
724×590×807 |
|
Working Temperature (℃) |
≤1300 |
|
Temperature Accuracy |
±1 |
|
Furnace Tube Material |
Corundum Tube |
|
Thermocouple Type |
S Type |
|
Temperature Uniformity |
±5 |
|
Heating Element |
Sic Heating Rod |
|
Chamber Material |
Alumina Ceramic Fiber |
|
Power Supply |
AC 220V, 50Hz/60Hz |
|
Net Weight |
95kg |
|
Gross Weight |
125kg |
- ➤ ±1°C accuracy
- ➤ 1400°C maximum operating temperature
- ➤ PID automatic control via current limiting phase angle fired the resistor
- ➤ 30 segments “time–temperature curve” can be set arbitrarily
- ➤ The tube furnace uses high-purity quartz or alumina tubes as furnace tubes
- ➤ The furnace tubes are designed to be installed horizontally
- ➤ The temperature zone is designed to be single zone
- ➤ Used for high-temperature material synthesis, sintering, annealing, crystal growth, powder metallurgy, ceramic processing, semiconductor diffusion, coating development, and heat treatment experiments in laboratories
- ➤ Touch screen (with USB interface)
- ➤ Computer connection software, control equipment (RKC, 16-segment program + interface + software)
- ➤ Safety interlock (power-off function when door is opened)
- ±1°C accuracy
- 1400°C maximum operating temperature
- PID automatic control via current limiting phase angle fired the resistor
- 30 segments “time–temperature curve” can be set arbitrarily
- The tube furnace uses high-purity quartz or alumina tubes as furnace tubes
- The furnace tubes are designed to be installed horizontally
- The temperature zone is designed to be single zone
- Touch screen (with USB interface)
- Computer connection software, control equipment (RKC, 16-segment program + interface + software)
- Safety interlock (power-off function when door is opened)
Used for high-temperature material synthesis, sintering, annealing, crystal growth, powder metallurgy, ceramic processing, semiconductor diffusion, coating development, and heat treatment experiments in laboratories
